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With the rapid development of microelectronic packaging technology, it has also led to the rapid development of epoxy molding compound as the main electronic packaging material. In epoxy molding compound, the content of filler is as high as 60% to 90%, so the choice of filler and its performance have a very important influence on the performance of epoxy molding compound. The filler of epoxy molding compound is mainly silica powder. Although there are different classifications of silicon micropowders, they have the same characteristics as fillers, which are to improve certain parameters and characteristics of EMC, such as: reducing shrinkage, increasing strength, enhancing wear resistance, increasing thermal deformation temperature, and increasing Thermal conductivity, reduce thermal expansion coefficient, reduce cost, etc.

They have commonalities as well as individualities, such as: spherical silica powder has a larger filling amount than angular silica powder, good fluidity, and crack resistance; fused silica powder has low thermal conductivity and low linear expansion coefficient; Crystalline silicon powder has high thermal conductivity. Although spherical silica micropowder has excellent performance and good fluidity, the shortcomings of spherical silica micropowder such as high cost and low thermal conductivity have limited its application to a certain extent. Therefore, a kind of rounded crystalline silica micropowder has appeared on the market, also known as obtuse-angled silica micropowder. , Spherical silica powder.

Compared with the ordinary angular crystalline silicon powder, the rounded silicon powder particles have no sharp edges and corners, and the fluidity and filling amount are relatively high. It can combine the advantages of spherical silicon powder with good fluidity and high thermal conductivity of crystalline silicon powder. It is used in applications where fluidity is required. In the molding compound with good performance and high thermal conductivity. Compared with spherical silicon micropowder, due to the different production process, the cost of rounded silicon micropowder is lower and the fluidity is better. Therefore, the current market use is large. There is a demand for this environmentally friendly, high thermal conductivity, and high-filled rounded silicon micropowder product. On an upward trend, the fillet micropowder has good fluidity, high filling capacity, high thermal conductivity, simple process, convenient operation, and environmentally friendly preparation process.